IPC Specifications
- IPC-T-50 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
- IPC-FC-231 - Flexible Base Dielectrics for Use in Flexible Printed Wiring
- IPC-FC-232 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and
Flexible Bonding Films
- IPC-FC-241 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
- IPC-RF-245 - Performance Specification for Rigid-Flex Printed Boards
- IPC-D-249 - Design Standard for Flexible Single- and Double-Sided Printed Boards
- IPC-FC-250A - Specification for Single- and Double-Sided Flexible Printed Wiring
- IPC-D-330 - Design Guide
- IPC-SM-782 - Surface Mount Design And Land Pattern Standard
- IPC-D-352 - Electronic Design Data Description for Printed Boards in Digital Form
- IPC-SM-782 - Surface Mount Design and Land Pattern Standard
- IPC-2221 - Generic Standard on Printed Board Design
- IPC-2222 - Sectional Design Standard for Rigid Organic Printed Boards
- IPC-2223 - Sectional Design Standard for Flexible Printed Boards
- IPC-2224 - Sectional Standard for Design of PWBs for PC Cards
- IPC-2225 - Sectional Design Standard for Organic Multi-chip Modules (MCM-L) and
MCM-L Assemblies
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TRI-C Design, Inc. All rights reserved.
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